Evaporation Materials vs. Sputtering Targets

In thin film deposition, evaporation materials and sputtering targets are two of the most used sources. Each method offers distinct advantages depending on the application, material type and required film properties. Understanding the differences between these two techniques is essential for selecting the best option for your project.

What Are Evaporation Materials?

Evaporation materials are used in physical vapour deposition (PVD) techniques such as thermal evaporation and electron beam evaporation. In these processes, the material is heated until it vaporises, then condenses onto a substrate to form a thin film.

Testbourne provides a wide range of high-purity evaporation materials including:

• Metals: Gold (Au), Silver (Ag), Platinum (Pt), Aluminium (Al), Titanium (Ti) and more.
• Oxides: Silicon Dioxide (SiO₂), Magnesium Oxide (MgO), Zinc Oxide (ZnO).
• Alloys: NiCr, Inconel and various custom alloys.
• Other Compounds: Fluorides, nitrides and sulphides for specialised coatings.

Advantages:

• High purity, ideal for optical coatings and electronics.
• Simple process, straightforward deposition with fewer impurities.
• Excellent film uniformity, especially for large-area coatings.

Limitations:

• Limited material selection (not all metals and compounds evaporate efficiently).
• Lower deposition rates compared to sputtering in some cases.
• May require complex crucibles or liners to prevent contamination.

What Are Sputtering Targets?

Sputtering targets are used in magnetron sputtering, a PVD process where ions bombard a solid target, ejecting atoms that then deposit onto a substrate. This method is widely used in semiconductor, display and coatings industries.

Testbourne offers an extensive selection of high purity sputtering targets including:

• Pure Metals: Copper (Cu), Tungsten (W), Molybdenum (Mo), Tantalum (Ta).
• Oxides: Indium Tin Oxide (ITO), Zinc Oxide (ZnO), Titanium Dioxide (TiO₂).
• Alloys: Titanium-Aluminum (TiAl), Nickel-Chromium (NiCr), and more.
• Carbides and Nitrides: Titanium Carbide (TiC), Silicon Nitride (Si₃N₄).

Advantages: 

• Wider material selection, including refractory metals and alloys.
• Higher film density and adhesion, ideal for wear-resistant coatings.
• Better process control, thin films with precise composition and thickness.

Limitations:

• More complex equipment setup compared to evaporation.
• Some materials require high-power sputtering sources.
• Slower deposition rates for certain materials.

Which One Should You Choose?

The choice between evaporation materials and sputtering targets depends on several key factors, including the type of material, the required film properties and the specific application.

If film purity and smoothness are your top priorities, evaporation is often the better choice. It is widely used for optical coatings, thin metal layers and delicate electronics because it produces films with fewer impurities and better uniformity. However, evaporation has limitations, as not all materials can be easily evaporated and the adhesion of the thin film may not be as strong as sputtered films.

On the other hand, if you need high-density coatings with excellent adhesion, sputtering is usually the preferred method. It is ideal for semiconductors, wear-resistant coatings and functional films because it offers better control over film composition and thickness. Sputtering also allows for the deposition of a wider range of materials, including oxides, nitrides and alloys, which may not be suitable for evaporation.

How Testbourne Can Help

At Testbourne, we supply a comprehensive range of high-purity evaporation materials and sputtering targets tailored to your needs. Whether you require custom alloys, precise purity levels or technical support, our team is here to assist you in selecting the best deposition material for your application.

If you are unsure which method to use, Testbourne’s team of experts can help you select the right materials and deposition process for optimal performance. Contact Testbourne today to discuss your project requirements.